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Created with Pixso. Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications

Nombre De La Marca: ZMSH
MOQ: 10
Tiempo De Entrega: 2-4 semanas
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
Shanghai, China
Material cristalino:
Cristal único al₂o₃
Estructura cristalina:
Trigonal (Hexagonal)
Opciones de orientación:
Plano C (0001), Plano A (11-20), Plano R (1-102), Plano M (10-10), Personalizado
Rango de tamaño (cuadrado):
5 × 5 mm – 150 × 150 mm
Rango de espesor:
0,2–10 mm (tal como se corta)
Condición superficial:
As-Cut (sin pulir), lapeado/SSP/DSP opcional
Rugosidad de la superficie (RA):
Corte: 0,5–2,0 µm (dependiendo del corte)
Dureza (Mohs):
9
Densidad:
30,98 g/cm3
El módulo de Young:
345–400 GPa
Conductividad térmica:
25–35 W/m·K a 20 °C
Coeficiente de expansión térmica:
5,0–8,4 ×10⁻⁶ /K (dependiente de la orientación)
Rango de transmisión óptica:
0,15–5,5 µm
Constante dieléctrica:
9,4–11,5
Descripción de producto

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications


Product Overview


Sapphire square raw wafer blanks are semi-finished single-crystal sapphire plates sliced directly from oriented sapphire boules. These blanks retain an as-cut, unpolished surface with natural saw marks and roughness, making them ideal for downstream precision processing including grinding, lapping, CMP polishing, thinning, and special-shape machining.


The material is α-Al₂O₃ single crystal, known for its exceptional hardness (Mohs 9), high thermal stability, strong chemical resistance, and wide optical transmission range. These characteristics make sapphire the preferred material for semiconductor wafers, optical windows, infrared components, and high-performance protective covers.


ZMSH provides sapphire raw blanks in a full range of dimensions, orientations, and thicknesses, offering complete customization according to customer processing requirements.

Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications 0Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications 1


Key Characteristics


  • Extreme Hardness (Mohs 9) — second only to diamond, scratch-resistant, wear-proof.

  • Excellent Optical Transmission — covers 0.15–5.5 μm (UV–Visible–Infrared).

  • High Thermal Stability — melting point 2053°C; withstands rapid thermal cycling.

  • Chemical Inertness — insoluble in most acids and bases (except HF & hot H₃PO₄).

  • Superior Electrical Insulation — stable dielectric properties at high temperatures.

  • Low Defect Density — ideal for semiconductor and optoelectronic processing.


Technical Specifications


Category Specification
Crystal Material Single Crystal Al₂O₃
Crystal Structure Trigonal (Hexagonal)
Orientation Options C-plane (0001), A-plane (11-20), R-plane (1-102), M-plane (10-10), Custom
Size Range (Square) 5 × 5 mm – 150 × 150 mm
Thickness Range 0.2–10 mm (as-cut)
Surface Condition As-Cut (Unpolished), optional Lapping/SSP/DSP
Surface Roughness (Ra) As-cut: 0.5–2.0 µm (dependent on slicing)
Hardness (Mohs) 9
Density 3.98 g/cm³
Young’s Modulus 345–400 GPa
Thermal Conductivity 25–35 W/m·K @ 20°C
Melting Point 2053°C
Coefficient of Thermal Expansion 5.0–8.4 ×10⁻⁶ /K (orientation dependent)
Refractive Index n₀=1.768, nₑ=1.760
Optical Transmission Range 0.15–5.5 μm
Dielectric Constant 9.4–11.5
Chemical Resistance Excellent; resistant to most acids/alkalis
Electrical Resistivity >10¹⁴ Ω·cm
Packaging Class-100 cleanroom


Applications


1. Semiconductor & LED Manufacturing

  • Raw material for polished sapphire wafers

  • GaN, AlN, Ga₂O₃ epitaxy

  • Micro-LED substrates

  • RF and power device components


2. Optical & Infrared Components

  • Infrared window blanks

  • High-temperature viewports

  • Laser protection windows

  • Optical flat substrates


3. Consumer Electronics

  • Camera lens cover (after polishing)

  • Fingerprint sensor covers

  • Smartwatch & wearable cover plates


4. Industrial & Scientific

  • High-pressure observation windows

  • Barcode scanner windows

  • Semiconductor equipment viewports


5. Aerospace & Defense

  • IR seeker windows

  • Optical domes

  • High-speed radome materials

  • Windows for harsh environments


ZMSH Processing Capability


ZMSH provides end-to-end sapphire machining services:

  • Crystal growth (KY/CZ)

  • Orientation & slicing

  • Lapping / grinding / thinning

  • CMP super-polishing

  • Chamfering & edge shaping

  • Step, slot, hole, and custom-shape machining

  • Ultra-thin & large-size sapphire processing

We provide one-stop solutions from raw blank to ready-to-use sapphire components.


FAQ


1. What is the difference between a raw wafer blank and a finished wafer?


A raw wafer blank is unpolished and retains as-cut roughness; finished wafers undergo precision grinding and CMP polishing.


2. Can the blank be customized?


Yes. Size, plane orientation, thickness, chamfering, and surface condition can all be customized.


3. Is sapphire suitable for infrared windows?


Yes. It has high transmittance from UV to mid-infrared (0.15–5.5 μm).


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