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Created with Pixso. 4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy

4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy

Nombre De La Marca: ZMSH
MOQ: 10 piezas
Precio: Pricing is subject to market fluctuations
Tiempo De Entrega: 2-4 semanas
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
Porcelana
Lugar de origen:
Porcelana
Diámetro:
100 mm/4 pulgadas
Espesor:
650±15 micras
Orientación:
Plano C(0001) ± 0,3°
Arco:
<15>
Rugosidad de la superficie frontal:
<0,2 nanómetro
Resistencia al calor:
>1500°C
Detalles de empaquetado:
Personalizable
Capacidad de la fuente:
1000 unidades/mes
Descripción de producto

Product Description

4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy

 


Overview

 

We produce 5N (99.999%) Purity monocrystalline Al₂O₃ for advanced semiconductor, optoelectronic, and optical applications.

These substrates are polished on a single side for excellent surface smoothness (Ra ≤ 0.2 nm). These substrates offer exceptional thermal stability (>1500 °C), high optical transmittance (~86–89% at 550 nm), and tight thickness uniformity (TTV ≤20 µm). They are ideal for LED epitaxial growth, GaN and III-nitride semiconductor devices, and high-temperature or optical applications.

4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy 1        4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy 2

 

 

Key Features

 

  • High-purity [5N (99.999%) Purity] single-crystal sapphire (Al₂O₃)

  • C-plane orientation (0001) with tight ±0.3° tolerance

  • Single side polished (SSP) surface, front Ra < 0.2 nm

  • Excellent flatness and low bow (<15 µm)

  • High thermal and chemical stability for harsh environments

  • Customizable axis, diameter, and thickness available

 

Specifications

Parameter Specification
Diameter 100 mm ± 0.3 mm (4 inch)
Orientation C-plane (0001), ±0.3°
Thickness 650 µm ± 15 µm
Bow <15 µm
Front Surface Single Side Polished (Ra < 0.2 nm)
Back side Roughness 
1.0 ± 0.2µm
TTV (Total Thickness Variation) ≤ 20 µm
LTV (Local Thickness Variation) ≤ 20 µm
Warp ≤ 20 µm
Material >99.999% high-purity Al₂O₃

 

 

Mechanical & Thermal Properties

 

  • Mohs hardness: 9 (second only to diamond)
  • Thermal conductivity: 25 W/m·K
  • Melting point: 2045°C
  • Low thermal expansion ensures dimensional stability4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy 3
 

Applications

 

  • Substrate for GaN, AlN, and III-V or II-VI epitaxial growth

  • Blue, green, white and UV LED production

  • Laser diode (LD) substrates4-Inch C-Plane SSP Sapphire Wafer for GaN / III-Nitride Epitaxy 4

  • Infrared (IR) optical components and windows

  • High-precision optics and microelectronics

  • Watch crystals&smartphone covers

 

Why Choose C-Plane Sapphire?

Sapphire substrate is ideal for high-performance optical and electronic applications. Sapphire offers exceptional hardness (Mohs 9), high thermal stability up to ~1500 °C, and excellent chemical resistance, a perfect choice for demanding environments such as during the MOCVD and MBE crystalline growth procedures. Its c-plane strucgture is also reasonably compatible with the crystal structure of III-nitrides, facilitating epitaxial alignment and uniform crystal growth. 

Packaging & Shipping

25 wafers in one cassette box by vacuum bag or customized method upon request

FAQ

Q: What is the optical transmittance range?
A: Transparent from ~200 nm (UV) to ~5000 nm (mid-IR).

Q: Is the wafer conductive?
A: No — sapphire is an insulator, ideal for preventing leakage currents in electronics.

Q: Can the wafer be customized?

A: Yes, we accept custom diameters, thicknesses, and axis orientation according to client specifications.

 

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