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Created with Pixso. ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

Nombre De La Marca: ZMSH
Número De Modelo: Equipo de sierra de alambre
MOQ: 1
Precio: by case
Tiempo De Entrega: 3-6 meses
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
PORCELANA
Certificación:
rohs
Potencia del motor principal:
11KW – 75KW
Velocidad del alambre:
0 – 40(m/s)
Máx. Longitud del cable:
20 – 150m
Fuente de alimentación.:
Estándar: Trifásico, 380V, 50Hz
Potencia del motor para caminar:
0,75 KW – 1,5 KW
Ángulo de rotación:
360°(Control eléctrico)
Control:
Funcionamiento automático/manual. Algunos modelos adoptan sistemas de control CNC o PLC.
Temperatura de trabajo permitida:
-15℃ ~ +40℃
Detalles de empaquetado:
Paquete en sala de limpieza de 100 grados
Resaltar:

vertical wire saw for sapphire cutting

,

horizontal wire saw for ceramics

,

multi-wire saw for marble materials

Descripción de producto

​​Equipment Overview and Core Value​​

 

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

 

 

 

The wire saw equipment utilizes a high-speed diamond wire as the cutting tool, where diamond abrasives are fixed onto a metal wire via electroplating or resin bonding, forming a flexible cutting system. Its core value lies in achieving ​​high-precision, low-damage cutting​​, significantly improving the processing efficiency and material utilization of hard and brittle materials (e.g., sapphire, ceramics, marble), overcoming the limitations of traditional methods in efficiency and accuracy.

 

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 0​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 1​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 2

 

 


 

​​Material Processing Characteristics and Applications​​

 
 
​​Material Dimension​​ ​​Sapphire​​ ​​Ceramics​​ ​​Marble​​
​​Core Characteristics​​ Ultra-high hardness (Mohs 9), high brittleness High hardness, high elastic modulus Non-uniform material, contains hard points like quartz
​​Processing Challenges​​ Prone to edge chipping and cracks Cutting surface prone to micro-cracks Uneven cutting surface and edge chipping
​​Key Metrics​​ Surface roughness can reach ​​Ra<0.5μm​​ Pursuit of cutting surface integrity, reducing micro-cracks High cutting efficiency, good slab flatness
​​Application Directions​​

LED substrates, optical windows, semiconductor substrates

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 3

Electronic ceramic substrates, packaging materials, structural ceramics

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 4

Architectural decorative slabs, countertops, carving crafts

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 5

 

 


 

​​Working Principle Highlights​​

 
 

The equipment grinds materials through a continuously circulating diamond wire at high speed, with technical focus varying by material:

  1. ​​Sapphire​​: Requires precise control of parameters like wire speed and tension to avoid brittle fracture (e.g., 20 m/s wire speed and 50 N tension can achieve a surface roughness of Ra<0.5μm).
  2. ​​Ceramics​​: Relies on the grinding action of the diamond wire to reduce stress concentration and minimize micro-crack generation.
  3. ​​Marble​​: Adapts cutting parameters intelligently to accommodate stone heterogeneity, ensuring flat cuts.

 

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 6

 

 


 

​​Processing Methods and Effects​​

 
 
​​Material​​ ​​Block Cutting​​ ​​Cross Cutting​​ ​​Multi-Wire Cutting​​ Effects​​
​​Sapphire​​ Narrow kerf (0.55mm), surface roughness <1μm, reduces material loss Fast cutting speed, suitable for ingot truncation and shaping Simultaneous multi-slice cutting enhances efficiency for materials like silicon wafers ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 7
​​Ceramics​​ Neat cutting surface, minimal edge damage, ideal for standard substrate preparation Suitable for precision machining of special-shaped components, high flexibility High-volume production of uniform components with high efficiency ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 8
​​Marble​​ High cutting efficiency, flat slab surface beneficial for subsequent polishing Used for block shaping and large slab division Single cut generates multiple large slabs, suitable for large-scale projects ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 9
 
 
 
 
 

 

​​Core Parameters​​

 
 
​​Parameter​​ ​​Range/Specification​​
Main Motor Power 11–75 kW (common models: 22kW, 37kW, 55kW)
Wire Speed 0–40 m/s (high-speed models up to 45 m/s)
Maximum Wire Length 20–150 m (increases with power)
Power Supply Three-phase 380V/50Hz (customizable)
Control Method Automatic/manual, supports CNC or PLC systems
Operating Temperature -15°C ~ +40°C

 

 


 

​​Service Commitment​​

 

 

ZMSH provides ​​integrated manufacturing and trading solutions​​, covering equipment selection, process optimization, and after-sales support:

  • ​​Customized Design​​: Configures parameters based on material properties (e.g., hardness, size).
  • ​​Technical Training​​: Offers operation and maintenance training to ensure efficient equipment performance.
  • ​​Full-Cycle Service​​: Provides end-to-end technical support and rapid response from trial cuts to mass production.

 

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials 10

 

 


 

FAQ of Wire Saw Equipment

 

 

​​Q1: How does a wire saw equipment achieve precise cutting?​​

A1: The equipment uses a high-speed diamond-coated wire that acts as a flexible grinding tool, abrasively cutting through materials while maintaining minimal kerf loss and high accuracy due to controlled tension and linear motion.

 

​​Q2: What makes wire saws suitable for environmentally sensitive operations?​​

A2: Wire saws eliminate the need for cooling fluids in many cases, reduce waste generation by up to 80% compared to traditional methods, and operate with lower noise and energy consumption, aligning with green manufacturing standards.

 

​​Q3: How do wire saws handle complex shapes or large-scale projects?​​

A3: With multi-wire configurations, they can simultaneously cut multiple slices from a single block, enabling efficient processing of intricate geometries or massive slabs—ideal for architectural stonework or semiconductor wafer production.

 

 


Tags: #Wire Saw Equipment, #Customized, #Vertical/Horizontal/Multi-Wire Cutting, #Sapphire/Ceramics/Marble Materials

   
 
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