Detalles del producto
Place of Origin: CHINA
Nombre de la marca: ZMSH
Certificación: rohs
Model Number: Custom-Shaped Quartz Through-Hole Plates
Condiciones de pago y envío
Precio: by case
Delivery Time: 2-4weeks
Payment Terms: T/T
Material: |
High-purity fused silica (SiO₂≥99.99%) |
Hole Diameter Range: |
0.1mm~50mm (Customizable) |
Thickness Range: |
0.2mm~20mm |
Transmittance @550nm: |
>93% |
Thermal Expansion Coefficient: |
0.55×10⁻⁶/°C |
Vacuum Compatibility: |
<10⁻⁷Pa |
Material: |
High-purity fused silica (SiO₂≥99.99%) |
Hole Diameter Range: |
0.1mm~50mm (Customizable) |
Thickness Range: |
0.2mm~20mm |
Transmittance @550nm: |
>93% |
Thermal Expansion Coefficient: |
0.55×10⁻⁶/°C |
Vacuum Compatibility: |
<10⁻⁷Pa |
Quartz custom-shaped through-hole plates are precision-engineered optical components manufactured from high-purity fused silica (SiO₂ ≥99.999%) using advanced laser drilling, grinding, and polishing techniques. Their core features include:
· Customized through-hole designs: Circular, square, spiral, bifurcated, and other non-standard apertures (0.2–100 mm) with ±0.01 mm precision, enabling complex light path control.
· Extreme thermal stability: Short-term resistance up to 1200°C, long-term operational stability at 800–1000°C, and a thermal expansion coefficient 1/10th of standard glass.
· Broad-spectrum transmittance: ≥90% (UV: 185 nm), ≥95% (visible), and ≥85% (IR: 3500 nm), ensuring optical purity without bubbles or striations.
· Tailored services: Support for customer-provided designs (2D/3D drawings), laser drilling customization (e.g., through-holes, countersinks, stepped holes), rapid small-batch delivery (3–5 days), and rigorous quality control (SGS-certified).
ZMSH specializes in manufacturing quartz custom-shaped through-hole plates for semiconductor equipment, photonics, and medical instrumentation, integrating design, processing, and testing to meet stringent requirements for precision, high-temperature resistance, and low scattering.
Parameter | Specification |
Material | High-purity fused silica (SiO₂≥99.99%) |
Hole Diameter Range | 0.1mm~50mm (Customizable) |
Hole Position Accuracy | ±0.01mm (Laser), ±0.02mm (CNC) |
Thickness Range | 0.2mm~20mm |
Surface Roughness | Ra≤0.5nm (Optical), Ra≤1.2nm (Industrial) |
Transmittance @550nm | >93% |
Thermal Expansion Coefficient | 0.55×10⁻⁶/°C |
Temperature Resistance | Long-term: 800℃, Short-term: 1200℃ |
Pressure Resistance | >20MPa (1mm thickness) |
Vacuum Compatibility | <10⁻⁷Pa |
Note: Custom hole patterns (e.g., hexagonal, microfluidic) and surface treatments available.
1. Material Properties
· Ultra-high purity: SiO₂ ≥99.999%, impurities <5 ppm, ensuring >90% UV transmittance at 200 nm.
· High-temperature resistance: Short-term tolerance up to 1200°C, long-term stability at 800–1000°C, with a thermal expansion coefficient of 5.5×10⁻⁷/°C.
· Chemical inertness: Resistant to strong acids (except HF), alkalis, and organic solvents.
2. Processing Precision
· Through-hole design: Circular, square, or custom shapes (e.g., spiral, bifurcated), aperture range 0.2–100 mm, ±0.01 mm precision, surface roughness <0.5 nm.
· Laser drilling: Utilizes femtosecond or UV lasers for stress-free processing, achieving smooth hole walls with no edge chipping.
3. Optical Performance
· Wide-spectrum transmittance: UV (185 nm) >80%, visible (400–700 nm) >95%, IR (3500 nm) >85%.
· Low scattering: Surface figure accuracy λ/10@632.8 nm, minimizing light energy loss for high-precision imaging and sensing.
4. Mechanical Properties
· High compressive strength: >1000 MPa, resistant to mechanical shock and vibration.
· Lightweight: Density 2.2 g/cm³, 15% lighter than K9 glass, ideal for aerospace applications.
5. Surface Treatments
· Coating options: Anti-reflective (AR, R<0.5%@400–1600 nm), reflective (Al/Ag, R>95%), and laser damage-resistant coatings (threshold >10 J/cm²).
· Chamfer design: <0.2×45° protective chamfer to reduce stress concentration.
1. Semiconductor Manufacturing
· Wafer inspection: Photolithography equipment alignment elements for UV lithography precision.
· Packaging testing: Infrared thermal imaging windows for high-temperature encapsulation.
2. Photonics
· Fiber coupling: Laser/detector windows with low insertion loss (<0.5 dB).
· Waveguide multiplexers: Multi-channel light path splitting via custom apertures.
3. Medical Devices
· Endoscopic imaging: Steering prisms and light path folding elements for enhanced resolution.
· Laser therapy: Precision light guidance in ophthalmic surgeries, compatible with high-temperature sterilization.
4. Research & Industry
· Quantum communication: Light path folding in single-photon detectors for low-scattering designs.
· Laser processing: Laser path control in cutting/welding systems, enduring >10⁶ W/cm² power density.
5. Aerospace
· Satellite remote sensing: UV imaging system windows with radiation and thermal shock resistance.
Quartz Crystal Boat Customization Services
ZMSH specialize in processing high-purity quartz boats using imported materials (e.g., GE, Heraeus), offering customized solutions based on client-provided drawings. Our services include laser cutting, CNC machining, and precision welding, ensuring ±0.01 mm accuracy to meet semiconductor and photovoltaic industry demands for high-temperature resistance (1200°C) and low thermal expansion. With ISO 9001 certification, we provide rapid prototyping (3–5 days) and mass production capabilities, optimizing process efficiency in lithography, diffusion, and other critical applications.
1. Q: What are quartz aperture plates used for?
A: Quartz aperture plates are used for precision light control, fluid transfer, and gas diffusion in semiconductor lithography, microfluidics, and high-power laser systems due to their heat resistance, optical clarity, and customizable hole patterns.
2. Q: Why choose quartz over metal or polymer aperture plates?
A: Quartz offers superior thermal stability (up to 1100°C), UV transparency, and chemical resistance, outperforming metals (thermal expansion) and polymers (durability) in harsh environments.
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