The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processesCombina la excepcional dureza del zafiro, la resistencia a altas temperaturas y la transparencia óptica con las capacidades de micro/nanoestructuración del TGV.